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Ciena at DesignCon 2027

February 2–4 | Santa Clara, CA | Booth #701

Interconnects built for performance at AI scale

The next generation of AI demands more from every connection. Join us at DesignCon 2027 to explore the technologies enabling AI-driven data centers and delivering reliable performance at scale—from deployment-ready, Nitro-enabled active copper cables for scale-up to efficient CPO/NPO technology powered by Vesta optical engines for longer reach.

Also see how our advances in 448G signaling are shaping the future of electrical interconnects and how our contributions to open ACC standards aim to expand sourcing flexibility.

DesignCon 2027

  • February 2–4
  • Santa Clara Convention Center
    5001 Great America Parkway
    Santa Clara, CA 95054
  • Booth #701